I.O. Interconnect is a specialized semiconductor manufacturer and service provider focused on advanced packaging, interconnect solutions, and integrated circuit assembly. The company provides critical backend semiconductor services, including system-in-package (SiP) integration, flip-chip packaging, and precision substrate design. With a strong emphasis on high-performance computing, networking, and communication applications, I.O. Interconnect supports fabless semiconductor companies and OEMs with turnkey solutions from design through volume production. Their expertise in 2.5D/3D packaging and heterogeneous integration positions them as a key player for next-generation semiconductor needs. The company is known for its engineering support, quality management, and ability to handle complex, high-density interconnect challenges.